03Quality ExcellenceStrict Adherence to the ISO-9001 Quality Management System Ensures High-Quality Products

SMT Quality Control

To enhance the control over the soldering quality of SMT products, the company has incorporated three-dimensional solder paste inspection equipment. This technology can assess the printed solder paste in terms of volume, area, height, offset, shortages, excess, solder bridging, solder spikes, and contamination. This significantly elevates the soldering quality of SMT, especially for components like BGAs and the 0201 package. Every SMT production line is equipped with an Automatic Optical Inspection (AOI) system. This system is capable of detecting post-soldering defects such as component misalignment, insufficient solder, short-circuits, contamination, missing parts, tilt, tombstoning, billboarding, flipped components, incorrect components, damages, elevated placement, polarity issues, cold joints, void soldering, adhesive spills, solder voids, and unreleased pins. Moreover, the AX8200 high-capacity, high-resolution, and high-magnification X-RAY inspection system has been implemented to guarantee the impeccable quality of BGA soldering. Throughout the production process, we manage both ROHS-compliant and non-ROHS processes in separate workshops.

Assembly Product Quality Control

To ensure the quality of the entire assembly product, our company is outfitted with a plethora of equipment like ICT (In-Circuit Test), FCT (Functional Circuit Test), PCBA functional testing instruments, metrological instruments, and fully equipped laboratories for comprehensive quality control. All assembled products undergo a Full Function Test (FCT), ensuring a functional qualification rate of over 99% for the delivered products. We have set up various in-process quality monitoring tools and facilities, including electric screwdriver torque calibration instruments and test software flag management, ensuring no untested products move to the next process.